Ultra small MOSFETs for power management: Get 3 A out of a 1mm² package MOSFET
Miniaturization without compromising performance
For all portable applications, but especially in tablets, e-readers and smart phones, there is greater need for smaller, low-power actuators and low ohmic switches. Newly developed high-performance, low RDSon MOSFETs in very small and ultra-small packages address the trends towards higher efficiency, increased power density and lower power consumption. Ideal for many applications including ultra-small load switches, power conversion and charger switches, these new MOSFETs in DFN packages deliver excellent performance on a small footprint.
What will attendees learn:
- How space saving pays off by using smaller leadless package MOSFETs
- Thermal capability and related maximum drain current of these new devices
- Advantages of the special “wettable flanks” for optical solder joint control
Jens Schnepel, Product Marketing Manager, NXP
Jens Schnepel is Product Marketing Manager at NXP Semiconductors responsible for the small-signal MOSFET group. Previously he was working at Infineon in business development for mobile reference platforms. He holds a degree in Telecommunications.
Conrad Rodriguez, Marketing Director, Standard Products, NXP
Conrad Rodriguez is NXP’s Americas Marketing Director for Standard Products—He just celebrated his 5th anniversary with NXP and has over 14 years of experience in the Semiconductor Industry. Working closely with major OEMs and supply-chain partners Conrad has unique insight into the Semiconductor Manufacturing Eco-System. Conrad studied at the University of Glasgow in Scotland and is based out of Cary, North Carolina.
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