Augmented Reality (AR) will seamlessly merge the real world with virtual objects, providing an always-on experience that intelligently enhances our lives. It will transform the way we live and interact with the world, offering unprecedented experiences and increased productivity. Because of this, AR is likely to be the next mobile computing platform.
Making this vision possible requires many new technologies in three key areas: immersion, cognition, and connectivity. Making this happen seamlessly in a mobile wearable device will not be easy, but Qualcomm Technologies is already developing the foundational mobile technologies.

Attend this webinar to learn about:

  • The evolution of AR from today to the future
  • The unprecedented experiences and unlimited possibilities that AR will offer
  • The technology advancements required in areas such as 3D graphics, machine learning, computer vision, and 4G/5G to support realistic, intelligent, and personalized AR
  • Why Qualcomm Technologies is uniquely positioned to lead in AR


Tim Leland, Vice President of Product Management, Qualcomm Technologies

Tim Leland serves as a vice president of product management in the Snapdragon application processor management team of Qualcomm Technologies Inc., located in San Diego, California. His current business and technology management responsibilities include product definition, planning, and partnerships for Qualcomm’s Adreno family of visual processing subsystems for 3D graphics, video, display, and touch controller processing, as well as Qualcomm’s Spectra camera ISP and associated Snapdragon software for computer vision, virtual reality, gaming, and a variety of development tools. Tim joined Qualcomm in 2007. Prior to joining Qualcomm, Tim worked for Nvidia, AMD and other companies. Having lived and worked abroad, Tim has a strong background and interest in international business, and foreign languages. His educational background includes masters studies in electrical engineering at the University of Santa Clara, and a bachelors degree in materials science engineering from the University of Washington in Seattle, Washington.