Whether you’re developing a next-gen USB 3.1
device or integrating existing silicon, you probably have questions about
“SuperSpeed USB”. USB 3.1 transforms the workhorse USB interface into a
high-speed (up to 10 Gb/s), high-power (up to 100 watts) platform that remains
compatible with its predecessors. As with any new technology, interoperability
issues are sure to emerge—and new characterization and validation challenges are
coming your way. Join us for a head start on the tools and techniques you’ll
need to get your USB 3.1 design work done right, including a complete overview
of the new specification and details on 10 Gb/s signaling—and the test
challenges that come with it.

Join the webinar to learn about:

  • Physical layer differences between USB 3.1 and 3.0
  • USB 10 Gb/s channel definition and jitter budget
  • New 128b/132b encoding and impact on test solutions
  • Transmitter validation methodologies including link analysis
  • Updated training sequence, compliance patterns and jitter tolerance
    requirements for receiver testing

After the webinar, join Tektronix
for a live discussion and your opportunity to ask questions.

White, Product Manager for Oscilloscopes, Tektronix

Randy White is
the Product Manager for Oscilloscopes at Tektronix. He has worked in the test
and measurement industry for 10 years. Randy holds a BSEE from Oregon State
University, and a MBA from Portland State University.