Companies migrating RFIC designs to advanced technology nodes and extended frequency ranges are facing rising concerns about the accuracy of passive RF device and interconnect models available in their design flow. High frequency losses and high aspect ratio interconnects are driving the creation of more complex structures based on both thick and thin metal for RF passive devices such as spiral inductors, baluns, MIM caps, and general device to device interconnects. It is becoming increasingly important to accurately model these passive components even during technology development to enable RF design engineers to meet aggressive product schedules.

In this Webcast, attendees will discover an efficient and integrated approach to RFIC on chip passive modeling:

  • Today's RFIC design and modeling challenges
  • Why use a planar electromagnetic solver?
  • From Layout GDSII to S-Parameter models
  • Practical examples and testimonials

    Duration: 1 hour including Q&A

    Who should view this Webcast:
    RFIC designers (cellular transceivers, Power Amps), RFIC design managers, CAD engineers supporting RFIC designers, CAD managers, and all those involved in the design, verification and characterization of RFICs.

    Paul Colestock:
    Paul Colestock has over 15 years of experience in wireless and high speed semiconductor product and technology development, EDA and marketing. He is currently RFIC EDA Product Marketing Lead for Agilent EEsof focused on helping position the company as the pre-eminent EDA supplier for wireless RF subsystem design and analysis. He has held leadership positions at Cadence Design Systems, Jazz Semiconductor, Hesson Labs and Silvaco International.

    Filip Demuynck:
    Filip J. Demuynck was born in Brugge, Belgium, on May 23, 1967. He received the M.S. and Ph.D. degrees in electrical engineering from the Katholieke Universiteit Leuven, Leuven, Belgium, in 1990 and 1995, respectively. He held a postdoctoral research position at the same university before joining Alcatel, Antwerp, Belgium. In 1996, he joined the EEsof EDA division of Hewlett-Packard, currently Agilent Technologies, in Gent, Belgium, working on the development of an electromagnetic simulator and its integration in an EDA environment. From 2000 to 2007, he worked as a senior consultant/project manager on client EDA solutions. Since 2008, he is the operating manager of the 3D-planar EM simulation team.