Power Module on Single IC: Save Board Space, Reduce Design Time and Lower Costs for your Point of Load Power Supply
Overview:
If your FPGA, DSP or ASIC designs requires a power
solution to deliver high output power, or if you have a critical space
constraint in your POL power supply, then please join Tim Lok for a 30 min
webinar to learn more about how Intersil’s power modules may be a good fit for
your system. This webinar will introduce Intersil’s highly integrated
encapsulated DC-DC power modules, with a strong focus on our newest product, the
ISL8225M, which offers the industry’s highest output current 30A in a single IC
package.
Two lucky attendees of the live webinar will receive a free
ISL8225M evaluation board in a random drawing that will be held after the
webinar has ended.
What registrants will learn:
- What is a fully encapsulated DC-DC module
- How Intersil power modules reduces design time, cost and complexity
- How optimized thermal packaging allows Intersil power modules to operate
over wide temperatures
Presenter:Tim Lok,
Marketing and Business Developer, Power Management Products Group,
Intersil
Tim Lok is a marketing and business developer for Intersil
Power Management products group focusing on Intersil’s power module products.
Tim started his career with Intersil six years ago in the Applications
Engineering group.
Please disable any pop-up blockers for proper viewing of this webinar.