PCI Express (PCI™) is the I/O technology of choice in high performance desktop and server applications. Now PCI Express signaling is continuing its delivered performance and bandwidth, moving to PCI Express 3.0 at 8GT/s. While the physical interface speed did not double, the effective data rate is doubling through changes in the encoding scheme. PCI Express 3.0 present new challenges to the industry. For example, at 8GT/s provides significant challenges on the physical layer and signal integrity design and validation. Also, the changes in the encoding scheme creates challenges in debugging and validating the logical and functional design of your system.

This presentation will provide you with an overview of the latest developments in PCI Express 3.0 standards, some of the areas of the specification that would be key to consider for a successful PCI Express 3.0 design. This presentation will also highlight some of the test solutions provided by Agilent to help you navigate the challenges in the PCI Express 3.0 specification, covering both the physical layer tests as well as protocol tools for functional and logical test and development.

Duration: One hour

Who should view this webcast:
Silicon & Chipset vendors, system vendors and OEMs

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Yenyi Fu, Senior Product Manager, Digital Debug Solutions, Digital Test Division, Electronic Measurements Group, Agilent Technologies
Yenyi Fu is a product manager with Agilent Technologies for its digital debug solutions group, managing the serial protocol testing business, including SAS/SATA, HDMI and PCI Express. In her current role, she works with multiple industry leaders and standard bodies in defining strategies to enable faster technology adoption.

Yenyi has been working in the test and measurement industry for the past 10 years, and has experience in both computing technologies as well as networking technologies.

Yenyi has a B.A in Electrical Engineering, B.A in computer science from The University of Melbourne, Australia, as well as a Masters in Information Technology from Monash University, Australia

Rick Eads, Senior Program Manager, Design Validation Division, Network and Digital Solutions Business Unit, Agilent Technologies
Rick is a senior product manager with expertise in technical/industrial marketing of test and measurement tools and electronic design automation software to leaders in the computer, semi-conductor, wired and wireless communications, storage and aerospace industries worldwide.

Rick works on precision product definition and synthesis of breakthrough solutions that address new and emerging needs for both software and hardware products. He provides technical leadership in driving standards within industry organizations for PCI Express, ExpressCard, FB-DIMM (FBD), DDR, HyperTransport, ExpressCard, SATA, and InfiniBand. He has worked in marketing test and measurement products covering oscilloscopes, Logic Analyzers, microprocessor emulation solutions, ASIC emulation tools, EDA tools.
Rick earned a M.B.A. from the University of Colorado with an emphasis on financ