Overview:
PCI Express (™) is quickly moving to the 3rd generation of higher speed and performance with PCI Express 3.0 at 8GT/s. This is a significant upgrade which presents signal integrity challenges on the physical layer for engineers performing debug and validation to the latest CEM and Base Specifications issued by the PCI-SIG. This presentation will bring you up to speed on the PCI-SIG’s latest updates to the PCI Express 3.0 CEM and Base Specs, as well as testing guidance to ensure that engineers can accomplish a successful integration of PCI Express 3.0 into their designs. The presentation will also unveil a new toolset designed by Tektronix to simplify PHY Layer debug and verification of PCI Express 3.0 designs.

Attendees will learn:

  • How to plan for electrical testing of new PCI Express Gen 3 Specification
  • How to make proper instrument setup and measurements for PCI-SIG CEM and Base Specs
  • The “why” behind new transmitter jitter measurements for PCI Express Gen 3
  • Proper Receiver characterization techniques for PCI Express Gen 3

Presenter:
Sarah Boen
Sarah is the PCI Express Product Marketing Manager at Tektronix, Inc. Sarah represents Tektronix on the PCI-SIG. She holds a BSCS and MBA from the University of Portland and has been actively involved with computer and semiconductor technology development at Tektronix for over 5 years.