Modern power devices and materials (such as
HVMOS, GaN and SiC) present many difficult measurement challenges that require
new methods and equipment. This web seminar will show new solutions and
techniques from Agilent Technologies and Cascade Microtech that make high power
device testing at currents and voltages up to 1500 A and 10 kV easier than ever
before. Learn how you can safely and efficiently characterize both packaged and
on-wafer power semiconductor devices with unprecedented speed and

Who should view this webcast:
Professors, educators, and students involved with high power semiconductor
device research.
Industry: Test engineers, design engineers, product
engineers, quality engineers, failure analysis engineers, reliability engineers,
scientists and researchers involved with high power semiconductor device
characterization and test.

Wadsworth, Agilent Technologies

Alan Wadsworth is the North and
South American Market Development Manager for Agilent’s semiconductor test
division. Alan holds bachelors and masters degrees in electrical engineering
from the Massachusetts Institute of Technology and an MBA from Santa Clara
University. Alan has over 25 years of experience in the semiconductor industry
in both design and test.

Swe, Product Marketing Manager for the integrated systems at Cascade Microtech,

Toe specializes in high-power device testing at wafer level.
Prior to joining Cascade Microtech, ToeNaing spent over eight years as a device
modeling consultant at Agilent Technologies, Inc where he provided device
modeling and characterization services to leading semiconductor foundries and
research institutions. Toe Naing also founded the Semiconductor Measurement and
Modeling Company (SMMC) in Singapore which provided innovative modeling
solutions in the semiconductor industry. ToeNaing holds Master of Engineering
(MEng) in Electrical Engineering from the Nanyang Technical university in