MEMS Foundry Manufacturing and CMOS integration - Challenges and Solutions
In the past five years we have seen a huge step in the evolution of MEMS applications. Some may even call it a revolution. Traditionally, Inkjet printer heads and automotive applications have dominated MEMS volume production. Today, demand for MEMS is particularly high in the consumer and mobile sector with further applications appearing every day. Part of this MEMS revolution has been the changing requirements for associated ASIC CMOS intelligence. Many manufacturers who currently use discrete MEMS devices are now seeing the benefits of integrated CMOS.
This webinar covers various aspects of X-FAB’s MEMS foundry offering with a particular focus on the integration of CMOS with MEMS devices. Examples of how integration can be achieved, considerations for designers, cost advantages and trade-offs will be discussed.
Iain Rutherford, Product Marketing Manager, MEMS Product Line, X-FAB Group
Iain Rutherford is the Product Line Manager for MEMS at X-FAB, based in Erfurt, Germany. Working closely with X-FAB’s MEMS Development group, Iain’s role covers business and technical aspects of MEMS production in the pure-play foundry sector.
With 20 years in the Semiconductor and MEMS industry, Iain’s experience includes process engineering in high-volume wafer manufacturing, specialist device manufacturing in R&D, wafer inspection and metrology with an equipment supplier. Iain has previously worked with KLA-Tencor, Motorola, Digital Equipment and the University of Edinburgh.
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