Innovation in Logic Packages
Looking to reduce your time-to-market and simplify the layout of your design? Learn all about Innovative Logic packages that will reduce your board space and simplify PCB routing. Learn about the evolution of Logic Packages, the differences in quality, price-level and performance between leadless ball mounted and surface mount packages, and find out how you can decrease the size of your design while also improving your time-to-market!
What will attendees learn?
• Trends in Logic Packages
• Market direction
• Mechanical Performance, Leadless VS Leaded and WCSP
• Cost advantages of Leadless over WCSP and Leaded packages
• Replacing WCSP and Leaded packages with Leadless packages
• Benefits of Leadless packages
Who should attend?
Application Engineers, Distributor Sales Engineers, Design/Hardware Engineers, Product Quality, Engineers, Test Engineers, System Architects, Engineering Management, Engineering Students
Cliff Lloyd, International Product Manager for Low-Voltage CMOS Logic
Cliff has a broad experience in semiconductor design, marketing and business development. Cliff is the #1 point of contact of cellular phone makers in the U.S. and Korea. When it comes to packaging, Cliff knows the trends in the market and truly understands the challenges that all designers are faced with when optimizing their design and time-to-market.
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