Overview:
This presentation gives an overview on the increasing challenge to achieve miniature camera modules in mobile devices high production and assembly yields. The presentation will review the factors that cause the increase in the challenge complexity, and how Optical Image Enhancement (OIE) technologies are employed to meet overcome it. It begins with the reason behind the increase in achieving high manufacturing yield challenges and goes on to review the various solutions. It uses multiple real data examples and graphical illustrations to demonstrate the issues at hand.


Attendees will learn:

  • What are the challenges of achieving good manufacturing yields in the dynamic mobile devices camera module environment
  • The trends that increase this challenge.
  • How OIE technologies are actually employed to overcome the high production yield challenge
  • Specific numeric examples of the contemporary industry best practice.


Presenter:
Dr. Giles Humpston, Director, Applications – Europe
Dr Giles Humpston, is a metallurgist by profession and has a doctorate in alloy phase equilibria; both degrees being obtained from Brunel University, UK. He is a cited inventor on over 200 patent applications, speaker at 35 conferences and has co-authored more than 90 papers and four text books. Dr Humpston is the recipient of six international awards for his work on soldering and brazing and two ‘best paper’ awards on wafer level packaging. He is currently the Director of Applications for Tessera (Europe) where his brief includes optical devices, solid state cameras, and electronics packaging and cooling technologies.