Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction
As advanced automotive safety systems become more mainstream, designers are challenged with reducing their system cost, while maintaining high performance in both the printed circuit board (PCB) and its components. To realize these requirements, PCB hybrid processing techniques can be used, whereby critical layers employ the highest performance circuit board materials, as other layers use materials that are more traditional, such as standard FR-4. This webinar describes the PCB material requirements for advanced automotive safety systems, highlights the methods and advantages of hybrid PCB design & manufacture and explores high-performance PCB materials designed specifically for 24 GHz and 77 to 81 GHz applications.
Attendees Will Learn:
- Printed circuit board material requirements for advanced automotive safety systems
- Printed circuit board material processing requirements for hybrid construction
- The benefits of using hybrid PCB construction
- The availability of printed circuit board material to support hybrid PCB construction for high-speed digital and RF/microwave/millimeter wave applications.
Senior Manager of Military & Aerospace and Microwave Design Specialist, Isola Group
Mike Miller is the Senior Manager of Military & Aerospace and Microwave Design Specialist for the OEM marketing team at Isola Group. Mike has more than 25 years of experience in RF/microwave and electromagnetics; having held senior engineering positions at General Atomics, ANSYS, Boeing, Northrop-Grumman and Lockheed-Martin. His career has focused on antenna and radome design, the design, simulation and application of engineered EM materials, and RF subsystems and channels. Mike has specialized in the application of computational electromagnetic tools. He has co-authored seven patents in antennas and electromagnetically tailored materials. Mike holds a MSEE degree from Arizona State University; he is an active participant in the Electromagnetic Code Consortium and currently a member of NDIA and IEEE.
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