Driving Toward Fabless Automotive Chip Design and Foundry Manufacture
IC content in cars has been growing exponentially, adding significant complexity to automotive chip design and manufacturing. Today’s cars feature many semiconductor applications such as tire pressure monitoring sensors and accelerometers for airbag systems. Add electronic components to improve engine performance, increase fuel efficiency, control modern entertainment and communications devices, provide Internet capability and handle new comfort functions… Now add the challenge of making the associated ICs survive for many years in extreme heat and cold, rain and snow, salt, g-forces, humidity, dry and dusty conditions…and you’ve got your hands full designing for one of the most harsh IC operating environments.
X-FAB is offering a free worldwide webinar on Sept. 27 and 28, 2011 for automotive electronics engineers. You will learn about the technologies and support X-FAB offers to help you solve the complex challenges of automotive design. You’ll see how X-FAB drives automotive requirements as an integral part of its business processes – from process development to design and prototyping support to mass production, including its zero ppm approach, 6-sigma modeling, high-temperature characterization, process robustness, defect density and extended ESD support. In short, you’ll learn how X-FAB’s focus on automotive ICs can make your job far easier.
Alexander Muffler, Technical Marketing Manager, X-FAB Group
As Product Marketing Manager, Alexander Muffler is responsible for the development of product marketing strategies for analog, automotive and NVM technologies. Prior to joining X-FAB, he worked for Chartered Semiconductor as EDA Manager Europe. Earlier, Alexander worked as an ASIC design engineer at Thesys Gesellschaft für Mikroelektronik mbH. Alexander has more than 17 years of semiconductor technology and design experience. He holds a Master’s degree in Telecommunication Engineering from the University of Applied Sciences in Konstanz, Germany.
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