DigRF is rapidly emerging as the next-generation serial interface between mobile baseband and RF chips. It is designed for use in high-bandwidth mobile systems incorporating air interface standards such as LTE (Long term Evolution) and WiMAX. The need for reliable data transfer on embedded multi-gigabit links while reducing power consumption represents a quantum leap in mobile digital system design technology. The integration of this new serial interconnect in RF-ICs strongly influences the RF-IC debug and test methodology changes , adding digital and protocol test challenges to wireless physical test of LTE interfaces.

This webcast will review the basic characteristics found in most embedded high speed serial links, such as link and protocol layers, power management , encoding schemes, and will articulate how these digital domain mechanisms influence testing RFIC transmit and receive paths — driving the need for cross domain test environments.

Duration: One hour

Who should view this webcast:
This webcast will be valuable to designers of wireless appliances that implement I and Q vector modulation, such as mobile handsets. It will be especially helpful for members of RF and BaseBand IC teams working on DigRF Test, DigRF V3, MIPI, OBSAI, LTE or WiMAX

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Jim Majewski, Agilent Technologies
Since the formation of Agilent, Jim Majewski has served as the product marketing manager for logic analyzers, the product planning manager for logic analyzers and oscilloscopes and as an R&D integrating manager in the Colorado Springs Technology Center. Jim is currently the product planner for Logic & Protocol Test tools product line of the Digital Verification Solutions Division.

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