Overview:
Modern systems are confronted with the need to deliver large amounts of power to integrated circuits and subsystems at high currents with low voltage drop and low noise. Delivering high quality power to devices through connectors requires the engineer to design for DC Power Integrity, Mechanical Contact Integrity, Thermal Power Integrity, and AC Power Integrity issues which extend through connectors to the printed circuit boards (PCB) and components themselves.

You are invited to join Scott McMorrow, President of Teraspeed Consulting Group LLC, for an informative presentation on the basics of DC Power Integrity Engineering and how it applies to board-to-board connector solutions. See how Samtec connectors and design data can be used to aid in the engineering of robust systems.

Topics covered in this webinar include:

  • Delivering high quality power to devices through connectors.
  • Designing for AC, DC, Mechanical Contact and Thermal Power Integrity.
  • Parameters in power delivery design.
  • Calculating and analyzing worst case DC path resistance and voltage drop.


Expected duration: 60 minutes

Speaker:

Scott McMorrow, President of Teraspeed Consulting Group LLC