Semiconductor devices such as CPU/AP, DRAM and SSD have enabled the IT revolution and continue to be a major driver of new technologies and industries. As the node sizes of the semiconductor devices go to sub-10nm, it becomes an extremely challenging task to understand not just the micro-scale but also macro-scale transport phenomena across the whole wafer to achieve high yield of semiconductor production.

The understanding of heat transfer and fluid flow of these complex semiconductor manufacturing processes has never been mature due to its complexity and the fast changing characteristics of the industry. We still largely rely on trial-and-error and DOE (design of experiments) for process evaluation and tuning. Computational modeling helps us better understand and optimize semiconductor fabrication process stages, like etching, deposition, and cleaning through thermal, flow, and reaction simulations, thus significantly impacting product development.

Through this webinar, we aim to share use-cases highlighting how Siemens Simcenter STAR-CCM+ is currently being successfully used in Semiconductor industry for simulating wafer manufacturing processes.