Advanced Power Dissipation
This webinar examines the influence of power dissipation and thermal resistance on semiconductor power components such as MOSFETs, smart switches and voltage regulators. In particular, time-dependent behavior will be discussed using the concept of the thermal impedance, or Zth(t) diagram, including thermal RC-modeling techniques. Practical calculation examples illustrate the real-world application of the theoretical concepts.
Bob Beier is a Senior Staff Applications Engineer at Infineon Technologies. Bob presently works on product definition and applications support for automotive smart power drivers. His prior experience at Infineon includes Marketing and Field Applications Engineering for automotive IC products. Prior to Infineon Bob worked at Ford Motor Company, Electronics Division, as a design engineer. Bob holds a Bachelor of Science (EE) from Michigan State University and also a Masters of Science (EE) from the University of Michigan.
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