Semiconductor companies are looking at new, system level approaches as continued efforts to keep up with Moore’s law are increasing price and design complexity. At the same time, demand for computational power, and the widespread applications of edge computing creates enormous pressure on the industry.

This webinar will provide an overview on how Siemens has curated a solution that allows an organization to move inputs from architectural fit studies to electrical layout to mechanical models, and then bring the inputs over to simulation to validate design parameters, explore additional designs that would be impossible for one engineer to consider, and then ground the data with calibrated test results. Siemens is currently the only EDA vendor that can implement a fully integrated solution that will allow organizations to reap the full benefits of digital transformation on a unified toolchain ecosystem.

Attendees will learn about:

  • High Density Advanced Packaging (HDAP) market drivers and technical challenges
  • A comprehensive end-to-end package design and analysis workflow
  • ECAD-MCAD exchange methodologies, building package models, package layout implementation
  • Adding detailed package models to PCB designs
  • Performing thermal and structural analysis, test based thermal model calibration
  • Design space optimization – driving the design with AI automation