The latest Intel Xeon processor presents new opportunities for high-density computing. The problem faced by design engineers is standard form factors do not take full advantage of the processor’s I/O. To overcome this, designers need new form factors that match the processor’s architectural advancements. This paper shows how Trenton Systems’ High Density Embedded Computing (HDEC) series form factor overcomes this barrier while maintaining compatibility with existing PICMG systems. This new architecture can bring high-density embedded computing to life in a wide variety of HDEC-enabled system applications, especially those for military computing, industrial automation, medical diagnostics, and energy production/exploration.