Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
This paper focuses on the characteristics of gap
fillers and how they impact a printed circuit board
(PCB) including compression characteristics of
various types of gap fillers, from standard viscoelastic
materials, to putties, to form-in-place. PCBs are
very flexible and deform quite easily; how deflection
impacts the overall compression of the gap filler will
be addressed. Finally, the paper will offer suggestions
for managing the stress created when implementing a
gap filler onto a PCB electronic assembly.
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