μModule Data Acquisition Solution Eases Challenges for Precision Applications
Hardware designers are demanding advanced precision data conversion performance and increased robustness for complex designs in an ever-shrinking form factor amid thermal and printed circuit board (PCB) density limitations. Heterogeneous integration via system-in-package (SiP) technology continues to advance key trends within the electronics industry, including the move to higher density, increased functionality, enhanced performance, and longer mean-time-to-failure. This paper illustrates a signal chain μModule solution that changes the precision conversion playing field.
- Data Acquisition System-Level Challenges
- Easing the Design Journey
- Small Form Factor Eases PCB Layout and Enables High Channel Density
- μModule Application Use Case: ATE
Higher Demand on Hardware Performance Despite Limitations
The electronics industry is quickly evolving the hardware sector, demanding the following:
- More advanced precision data conversion performance
- Increased robustness for complex integrated circuit designs
- A smaller form factor, despite thermal and PCB density limitations
System designers face a multitude of logistical challenges (component selection, optimizing design on final prototypes) as well as technical challenges (driving ADC inputs, protecting those inputs from overvoltage, minimizing system power, while achieving higher system production rates with low power microcontrollers.
The Solution – Heterogeneous Integration via System-in-Package (SiP) Technology
Thankfully, there are ways to advance these key trends in electronics. Heterogeneous integration via system-in-package tech offers higher density, better functionality, enhanced performance and a longer component lifetime. Analog Devices is providing a complete signal chain uModule solution with advanced performance, focusing on common sections of signal chain, signal conditioning and digitization.
Learn more about this uModule solution called “ADAQ4003” by downloading the free white paper below.
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