Thermal Transient Modeling and Experimental Validation in the European Project PROFIT
This paper presents the results of the European project PROFIT. Sixteen different packages from the three Semiconductor Manufacturers: Infineon, Philips and ST Microelectronics were measured in four Dual Cold Plate (DCP) environments as defined in the preceding DELPHI and SEED projects. TO-type and fine pitch measurement for the DCP-4 boundary condition and interface resistance reduction using Wood’s alloy are demonstrated.
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