Thermal Performance Comparison of a Microprocessor Using Phase Change Materials in Various Configurations
Increasing power densities in compact or mobile equipment or in so-called high density packages has escalated the need for alternative, improved cooling solutions. One such solution is the use of phase change materials (PCMs) that make use of the heat of fusion during the change of phase. This paper presents a set of transient computational analyses for selected IC packages with the purpose of calibrating the merits of PCM in different configurations.
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