The thermal design power (TDP) for Embedded Menlow is low, approximately 4.5W for the kit—the lowest kit TDP produced by Intel in recent history, but it is not low enough to overcome thermal issues in some In-Vehicle Infotainment (IVI) applications. Until TDP decreases, another way to meet automotive requirements is to provide package-level thermal enhancements that allow for reliable operation in thermally restrictive IVI systems.