In today’s embedded market, Advanced Telecommunication Computing Architecture (AdvancedTCA or ATCA) is a growing form factor in which thermal engineers are faced with several constraining challenges. ATCA is standard form factor established by leading telecommunication players to create a universal design specification in which customers can design to and be common among platform to platform. Some challenges in this design space include: volumetric constraints, environmental boundary conditions, and power limits. The intent of this document is to give thermal design guidance to thermal engineers and system designers to help with common thermal concerns.