Thermal solution design requires an engineer to fully understand the system and various form factor boundary conditions and component level attributes. This document will define thermal cooling schemes: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer (conduction, convection, and radiation). The thermal performance metrology will be explained, using a thermal resistance calculation and how to apply to Intel components. The methodology will highlight typical Intel component specifications such as TJ-MAX, TCASE-MAX, TAMBIENT and Thermal Design Power (TDP). In addition some thermal features such as the Digital Thermal Sensor (DTS) and Thermal Monitor will be explained.