Thermal Design Considerations for Embedded Applications
Thermal solution design requires an engineer to fully understand the system and various form factor boundary conditions and component level attributes. This document will define thermal cooling schemes: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer (conduction, convection, and radiation). The thermal performance metrology will be explained, using a thermal resistance calculation and how to apply to Intel components. The methodology will highlight typical Intel component specifications such as TJ-MAX, TCASE-MAX, TAMBIENT and Thermal Design Power (TDP). In addition some thermal features such as the Digital Thermal Sensor (DTS) and Thermal Monitor will be explained.
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