Thermal Considerations for a UCSP Package
The amount of power that an audio amplifier will dissipate is primarily limited by its package and external heat sink (whether a copper plane on the PCB or a metal heat sink). While more efficient amplifiers like Class D do not dissipate as much as conventional Class AB amplifiers, all amplifiers dissipate some power as heat. This application note discusses the power-dissipation capabilities of the UCSP package, and how that package can limit dissipated output power compared to other package options.
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