As we know the thermal performance of a package is getting much more important since the QFP family until today’s BGA family. The more components inside a chip, the more heat dissipation that engineer must force to dealing with. Most of semiconductor companies were using the ANSYS software to do the thermal simulation with 1/4 symmetric model of package. Base on the Finite Element Method it seems impossible to simulate the full package model or even on-board level analysis with detail package model. It’s really time consuming and also difficult to give the value of heat transfer coefficient for force convection case. This paper was using Flotherm software to simulate the full model of TBGA (Tape Ball Grid Arrays) package on test board to meet the high power dissipation ( 6 Watt ) requirement.

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