Thermal Analysis of Memory Module Using Transient Testing Method
The electrical transient testing method has become popular as a useful thermal analysis tool because of its accuracy, high repeatability and rich information content compared to the use of traditional steady state thermal characterization techniques. This paper presents a thermal study of a 16-chip memory module using transient testing. The two variables in this study are the thermal boundary conditions of and the power distribution within the module. By applying the method of network identification by deconvolution (NID) to a transient temperature measurement, we can identify the structure function, which is the dynamic thermal resistance versus capacitance along a particular heat flow path for a given boundary condition and power distribution.
Note: By clicking on the above link, this paper will be emailed to your EE Times log-in address by Mentor Graphics.
Please disable any pop-up blockers for proper viewing of this Whitepaper.