Thermal analysis of an UHP high current driver
The design of new electronic devices usually does not involve thermal issues. However for some products it is necessary to include thermal aspects in the design process. This can have major influence on the way the design of the product is developed. Typically, simulations are made with CFD packages like Flotherm to investigate the thermal performance of the proposed design. In this approach thermal specialists are involved which do not have to deal with other problems, involving electronics and mechanics. Therefore it is thought that it would be very useful for electrical designers to deal with thermal issues themselves already in the early stages of the design process. Due to the limited thermal knowledge of electrical designers it is necessary to give them easy applicable tools, which show the thermal consequences of choices made in the design process. Tools are derived from Flotherm simulations but also simpler software is used.
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