High Density Interconnect (HDI) printed circuits are now being designed in ever-increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics into the printed circuit has started to take off. In the next seven years, expectations are that photonic PCBs will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations.

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