Temperature issues are part of designers’ concerns and the solution affects the cost of a part, as package choice and die size are important factors in determining the cost of a final product. For smaller die sizes, such as those in discrete analog components, the cost/unit area of silicon is dominated by package and testing. For larger die sizes, such as complex mixed signal ICs, the wafer-fabrication costs dominate. Temperature data at the time of design can be proactively used in lowering the package cost, in detecting and avoiding catastrophic failures, and in accurately determining reliability of the part in mean-time-to-failure under realistic worst-case conditions.