As a concept, “System in Package” or “SiP” relates to the objective of merging many or all of the electronic requirements of a functional system or a subsystem into one package. It is a concept that can at once be understood by people familiar with electronics and packaging yet is very difficult to define in absolute terms. This technical paper discusses the SiP technology and explains its applications and market trends.

For more information on System-in-Package, visit
Amkor’s Web site.