Substrate coupling analysis has recently
become both an intensive research topic and emerging commercial EDA
demand in mixed-signal and RF applications. The traditionally
assumed insulation between devices, because of high resistivity and
carefully designed junctions, is disappearing to a point where
coupling between devices should be carefully analyzed. Degradation
of noise characteristics in RF circuits due to such coupling and
susceptibility of analog circuits to wide-range swings of digital
signals are the main concerns.