Structure Function: The Bridge of Thermal Measurement and Thermal Simulation
Now a days thermal simulators like FloTHERM are capable to run 3D thermal simulations with high accuracy. Structure Function, the key technology of Mentor Graphics product T3Ster, enables users to verify thermal simulation models against a physical device. It also provides a way to measure thermal properties of electronics packages such as thermal conductivity of the metal layer in a TO220 package, or thermal conductivity of TIM materials or grease.
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