Optocouplers are widely used in providing galvanic isolation because of their true isolation characteristics. In some applications, it is very desirable to increase the number of optocouplers in a single package in order to optimize manufacturing costs and save space on printed circuit boards (PCBs). However, previous engineering attempts to integrate more than two optocouplers into a single package have proved to be a challenge. The limitation is in the current hybrid manufacturing process of putting several LEDs and IC devices in a monolithic package.


The development of a new manufacturing process called Stacked LED Technology—stacking LED die directly on a silicon IC substrate—has helped to enable higher integration in monolithic IC packaging.


This paper introduces Stacked LED Technology and describes its unique components and benefits.