Solid solder deposits (SSD) have been employed in the manufacture of conventional surface mount devices since the early 1990s. As the technology developed, it was applied to diverse applications and today it used in the printed circuit board (PCB), SMD, and microelectronic industries. While a great deal of information has been disseminated on methods of forming deposits, relatively little has been published on how to implement SSDs in the assembly process. This paper discusses the qualification and implementation of SSDs in a manufacturing environment, as well as alloy composition, solder volume, uniformity, planarity/sphericity of deposits, and ionic cleanliness.