Solder Reflow Attach Method for High Power RF Devices in Over—Molded Plastic Packages
The purpose of this application note is to provide Freescale Semiconductor customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in over—molded plastic (OMP) packages. This document will aid customers in developing an assembly process suitable for their design as well as their manufacturing operation. Each Power Amplifier (PA) design has its own unique performance requirements. Similarly, each manufacturing operation also has its own process capabilities. Therefore, each design and assembly may require some fine—tuning. The intent of this application note is to provide the information our customers need to establish the process that is most suitable for their design and compatible with their manufacturing operations.
Please disable any pop-up blockers for proper viewing of this Whitepaper.