Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages. SMT rework can be necessary for any of the following reasons: assembly related defects, such as shorts, opens, wrong orientation, and solder ball defects; device/package related defects/failure analysis; and engineering change or system upgrade.

This white paper contains guidelines for the rework process, but does not guarantee the success of every rework process. Note that a maximum of three reflow cycles (including initial assembly, rework, and reballing) are allowed.