Mindspeed has taken a proactive role and worked with its suppliers and customers to develop and qualify material sets and processes for lead-free applications. The company’s lead-free packages comply with the most recent JEDEC J-STD-020 specification for peak reflow temperature requirements, and standard package reliability tests include temperature cycles, biased HAST, and high temperature storage.

The objective of this application note is to provide the basic Surface-mount Technology (SMT) design and process requirements necessary to ensure high assembly yield and product reliability for lead-free packages. Important factors affecting the SMT process and product reliability are discussed.