The LMV93x devices are offered in the latest packaging technology to meet the most demanding space-constraint applications. The LMV931 is offered in standard SOT-23 and SC-70 packages. The LMV932 is available in the traditional MSOP and SOIC packages. The LMV934 is available in the traditional SOIC and TSSOP packages. The LMV93x devices are characterized for operation from -40°C to 125°C, making the part universally suited for commercial, industrial, and automotive applications.