This white paper discusses how a MIPI M-PHY using High-Speed Gear3 operation can provide power-efficient high-speed links for a variety of mobile chip-to-chip communication standards and protocols, such as JEDEC Universal Flash Storage (UFS), USB 3.0 SuperSpeed Inter-chip (SSIC), and PCI-SIG M-PCIe, each of which are optimized for its particular purpose. The paper then explains how designers can solve signal integrity challenges in implementation, including channel loss, interconnect, and electromagnetic interference (EMI) issues.