This paper discusses RapidIO interconnect architecture, which provides a high-performance interconnect for board-to-board and chip-to-chip communications within embedded computer systems. The architecture provides the data bandwidth required for increasingly complex applications running on ever faster processors, and requiring ever more data to move between multiple processing stages.


RapidIO is targeted for embedded applications with the highest data communication requirements, such as networking, wireless communication infrastructure, digital video broadcasting, medical diagnostic imaging, military image and signal processing, and semiconductor wafer inspection.