Characterization of modern RF devices and integrated circuits is associated with serious challenges. Engineers are called upon to deliver high-precision measurement results, dealing with structures and multi-functional ICs that continuously decrease physical dimensions, increase operation frequencies, and increase the level of integration complexity. Based on leading technology in RF probing and probe system design, and over 27 years of experience and application expertise, this paper demonstrates the key to achieving accurate measurement results in the shortest time—with maximum confidence.