System-in-package (SiP) power modules from Texas Instruments provide ready-made, easy-to-use solutions for power supplies. SiP modules integrate a complete DC-to-DC converter power system in a single package using three-dimensionally stacked components. The result is increased power density and simpler designs, helping accelerate time to market and realize higher revenues. Developers can add a single device with a pre-tested, point-of-load power supply to their boards, avoiding the hassles of power design and devoting more time to product functions where their own expertise and added value are greatest.