Power spikes isolation to avoid corruption within sensitive ICs
Introduction of spikes in systems during insertion of power supply jacks is observed in a majority of designs. These spikes are mainly caused due to: a very high frequency de-bounce on the power supply jack during insertion and equalization of ground between power adapter and battery-powered system. In most cases, the ICs on the board don’t respond to such events. This paper highlights the step-by-step method we followed to isolate and resolve a power spike issue that is not common and our learning through this process.
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