This paper addresses special design considerations and failure analysis of high-frequency switchers and regulators employing external feedback components for mobile and automotive applications. The goal is to help familiarize designers with various mechanisms and circumstances that may lead to destruction of on-chip power switches. Techniques for averting and eliminating the effects of EOS conditions are discussed to help improve end-user products and PCB designs. This article also presents tips for conducting lab tests and suggests good engineering practices to obviate potential problems from occurring in highdensity/ultracompact mobile designs.