Advances in technologies are driving integration of more features and higher performance into smaller chip designs that is resulting in higher power and density. High power and density pose significant cooling challenges for system design as well as the facility housing the equipment. Designing cooling solution to manage temperature of these high power chips in a server is critical to reliable performance and life of the equipment. This requires a well-designed autonomous thermal management implementation that can enable minimal thermal guard-bands and the flexibility to configure the platform for performance and power reduction. Read the article to learn more about dynamic thermal management.