Package Thermal Resistance Values (Theta JA, Theta JC) for Dallas Semiconductor Temperature Sensors
Two common thermal-resistance values measured for IC packages are junction-to-ambient (Theta JA) and junction-to-case (Theta JC). These parameters are useful for calculating maximum power dissipation and self-heating, and for comparing package types. This paper presents Theta JA and Theta JC values for 1-Wire and all the Dallas Semiconductor temperature sensors. Examples for calculating the values are given.
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