Optimizing Insertion Extraction Force in a Pin-Socket Interconnect
IC Socket industry trends are impacted by a combination of technology and market- driven factors. Technology driven factors include miniaturization, increased pin counts, faster operating speeds, higher operating temperatures, and higher current carrying capabilities. Market driven factors include increased durability, shorter development cycles, and the need for more cost effective solutions. For many products designed with today’s high-performance integrated circuits, Ball Grid Array (BGA) socketing systems are an essential option during the design, testing, and/or production phases of the new product development process.
Please disable any pop-up blockers for proper viewing of this Whitepaper.